HIGHLIGHTS
- who: Pok Y.W. and collaborators from the School of Engineering and Science, Curtin University Sarawak Campus, CDT, Miri, Sarawak, Malaysia have published the Article: Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging, in the Journal: (JOURNAL)
- what: The full length of the model is 2L.The model is considered to be a unit of width in a direction perpendicular to the plane of the paper and the forces and moments are defined with respect to the unit width. Subsequently a parametric study was conducted to examine the influence of . . .
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