Low-temperature bonding for heterogeneous integration of silicon chips with nanocrystalline diamond films

HIGHLIGHTS

• What: The authors provide a solution for ensuring heterogeneous interface integration between silicon (Si) chips and NCD films using lowtemperature bonding technology.
• Who: Jicun Lu and colleagues from the School of Materials Science and Chemical Engineering, Harbin University of Science and Technology have published the paper: Low-Temperature Bonding for Heterogeneous Integration of Silicon Chips with Nanocrystalline Diamond Films, in the Journal: Micromachines 2024, 15, x FOR PEER REVIEW of /2024/

SUMMARY

To realize the bonding of diamonds to semiconductors, Zhong described the low-temperature 2 of 13 connection of diamonds . . .

 



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