HIGHLIGHTS
- who: Sover Alexandru and Amend Jonas from the Ansbach University of Applied Sciences, Faculty of Engineering Sciences, Residenzstr8, Ansbach, Germany have published the article: Direct metallization by a plasma coating process on thermal conductive polyamide, in the Journal: (JOURNAL)
- what: The deposition of copper on PA6 polymeric substrates after different processing conditions (injection moulding and laser structuring) was tested.
- how: This paper describes the metallization on highly filled thermal conductive Polyamide 6 material and the influence of the process conditions of the samples on the quality of the metal deposition.
SUMMARY . . .
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