HIGHLIGHTS
- who: zhanghaikun from the Academy for Advanced Interdisciplinary Research, North University of China, Taiyuan, China have published the research work: Type of the Paper (Article, in the Journal: Micromachines 2022, 13, 1191. of /2022/
- what: In this paper, a dual-bonding of Cu-Sn and Au-Au is proposed for wide-range graphene pressure sensor.
SUMMARY
Graphene is a hexagonal, honeycomb-shaped, two-dimensional material with thickness of approximately 0.335 nm. Common eutectic bonding includes Cu-Sn and Au-Sn bonding, but the melting point of AuSn20, a eutectic alloy . . .
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