Tear-and-interconnect domain decomposition scheme for solving multiscale composite penetrable objects

HIGHLIGHTS

• who: Tear-and-Interconnect Domain Decomposition and colleagues from the de Tecnologu00eda de los Computadores y Comunicaciones, Universidad de Extremadura, Caceres, Spain have published the research: Tear-and-Interconnect Domain Decomposition Scheme for Solving Multiscale Composite Penetrable Objects, in the Journal: (JOURNAL)
• what: The authors demonstrate that the T and amp;I SIE-DD approach can be further extended to expedite the solution of fully homogeneous as well as composite piecewise homogeneous penetrable objects including multiple materials and multiscale features.
• how: For the discretization of the integral equations the authors used the so . . .
  

   

  

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