Analysis of selective bonding processes using reactive multi-layers for system integration on ltcc based sips

HIGHLIGHTS

• who: A. Yuile from the Chair of Microintegration and Reliability, Saarland University, Campus, Saarbruu0308cken, Germany have published the article: Analysis of selective bonding processes using reactive multi-layers for system integration on LTCC based SiPs, in the Journal: (JOURNAL)
• what: Speed, and this could potentially be incorporated into the heat release function, so there is still scope for model development.
• how: In Figs 6 and 7 the main x-z and x-y plane dimensions used in the model are shown. These boundaries were used in the model such that air could be . . .
  

   

  

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