Interaction between electromechanical fields and carriers in a multilayered piezoelectric semiconductor beam

HIGHLIGHTS

  • who: Renzhong Hong and collaborators from the Department of Mechanics, School of Aerospace Engineering, Hubei Key Laboratory of Engineering Structural Analysis and Safety Assessment, Huazhong University of Science and Technology, Wuhan, China have published the paper: Interaction between Electromechanical Fields and Carriers in a Multilayered Piezoelectric Semiconductor Beam, in the Journal: Micromachines 2022, 13, 857. of /2022/
  • what: This study discusses the interaction between and carriers in a ZnO where the c-axis of every two adjacent layers is alternately opposite along the thickness direction. This study provides a new means for constructing electromechanical semiconductor . . .

     

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