Effect of vibration direction on two-dimensional ultrasonic assisted grinding-electrolysis-discharge generating machining mechanism of sicp/al

HIGHLIGHTS

  • who: Jing Li et al. from the School of Mechanical Engineering, Yangzhou University, Yangzhou, China have published the research work: Effect of Vibration Direction on Two-Dimensional Ultrasonic Assisted Grinding-Electrolysis-Discharge Generating Machining Mechanism of SiCp/Al, in the Journal: Materials 2023, 2703 of /2023/
  • what: This study proposes the mechanism of two-dimensional ultrasonic machining (2UG-E-DM). In this research, the 2UG-E-DM method was developed for machining hard and brittle conductive materials of MMCs (40% SiCp/Al) in different vibration directions. The experimental research focused on the grinding force and . . .

     

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