Diffusion bonding of al7075 to ti-6al-4v by spark plasma sintering and using a copper interlayer

HIGHLIGHTS

• who: Abdulaziz Alhazaa et al. from the Department of Physics and Astronomy, College of Science, King Saud University, Riyadh, Saudi Arabia have published the research: Diffusion Bonding of Al7075 to Ti-6Al-4V by Spark Plasma Sintering and Using a Copper Interlayer, in the Journal: Crystals 2022, 12, 1293. of /2022/
• what: Spark plasma sintering was successfully used to join Al7075 and Ti6Al-4V industrial alloys by using a copper foil as an interlayer without the need of a prior process such as surface coatings.
• how: The authors applied SPS to bond Al7075 . . .
  

   

  

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