HIGHLIGHTS
- who: Yifang Liu and colleagues from the Department of Instrumental and Electrical Engineering, Xiamen University, Xiamen, China have published the article: Void Suppression in Glass Frit Bonding Via Three-Step Annealing Process, in the Journal: Micromachines 2022, 2022, 13, 13,2104 x Micromachines of /2022/
- what: In this work, a stable optimized alternating three-step annealing process, which included the forming of glass liquid in air, the elimination of bubbles under vacuum, and the filling-up of pores in air was introduced to suppress the formation of voids.
- how: In the experiments transparent . . .
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