HIGHLIGHTS
- who: Tianyu Chen and Jianjun Li from the College of Mechanical and Electrical Engineering, Central South University, Changsha, China have published the article: Modelling the Shear Banding in Gradient Nano-Grained Metals, in the Journal: Nanomaterials 2021, 2468 of /2021/
- what: A dislocation density-based computational model is developed to investigate the shear band evolution in gradient Cu to overcome the above difficulty and to clarify the above debate.
- future: The authors will investigate the influence of strain rate on shear banding behavior of gradient metals in a future study. This result consistent . . .
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