A laser shock-based disassembly process for adhesively bonded ti/cfrp parts

HIGHLIGHTS

  • who: Panagiotis Kormpos and colleagues from the Laboratory of Technology and Strength of Materials (LTSM), Department of Mechanical Engineering and , University of Patras, Patras, Greece have published the research: A Laser Shock-Based Disassembly Process for Adhesively Bonded Ti/CFRP Parts, in the Journal: Processes 2023, 10, x FOR PEER REVIEW of 22/Dec/2022
  • what: In this work a novel disassembly technique based on laser-induced shock waves is proposed for the disassembly of multi-material structures. For the first part of the experiments, the single-sided shot configuration was used, as shown in . . .

     

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