A novel manifold dual-microchannel flow field structure with high-performance heat dissipation

HIGHLIGHTS

• who: Xing Yang et al. from the Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi'an, China have published the paper: A Novel Manifold Dual-Microchannel Flow Field Structure with High-Performance Heat Dissipation, in the Journal: Micromachines 2022, 1420 of /2022/
• what: In this work, a manifold dual-microchannel (MDMC) heat sink structure is proposed, this work, a manifoldstructure dual-microchannel (MDMC) heat sink structure whichIn embeds the microchannel into the manifold microchannel (MMC) struc- is proposed, which the microchannel into theThe manifold microchannel (MMC) structure. ture.
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