HIGHLIGHTS
- who: Zilang Hu and collaborators from the (UNIVERSITY) have published the Article: An Aging-Degree Evaluation Method for IGBT Bond Wire with Online Multivariate Monitoring, in the Journal: (JOURNAL)
- what: The aging fracture of bonding wire is one of the main reasons for failure of insulated gate bipolar transistor (IGBT).
- how: This paper proposes an online monitoring method for IGBT bonding wire aging that does not interfere with the normal operation of the IGBT module. In this study the neural_network model was used for subsequent data processing to deal with this relationship. The . . .
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