HIGHLIGHTS
- who: Seyed Amir Fouad Farshchi Yazdi et al. from the Department of Civil and Environmental Engineering, Politecnico di Milano, Piazza Leonardo Da Vinci, Milano, Italy have published the research work: An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer Bonding, in the Journal: Micromachines 2023, 14, 165. of /2023/
- what: In the standard, the failure load determines the sufficient bonding strength with respect to the die size; in this work the test was carried out at different displacement rates (1, 5, 10, and 15 u00b5m/s) to study the gf behaviour. For the . . .
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