An integrated model for adjustment of process parameters to recover throughput shortage in semiconductor assembly: a case study

HIGHLIGHTS

• who: Ho Kok Hoe et al. from the (UNIVERSITY) have published the research: An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study, in the Journal: (JOURNAL)
• what: The paper aims to develop and validate an integrated model to recover the throughput shortage through adjustment of process parameters in a semiconductor assembly setting.
• how: The case study was carried out in a semiconductor assembly line which consisted of three die attach machines four oven cure machines nine wire bond machines and three pre-cap inspection . . .
  

   

  

  If you want to have access to all the content you need to log in!

  Thanks :)

  Username or E-mail:

  If you don't have an account, you can create one here.