HIGHLIGHTS
- who: Rafat Saleh and colleagues from the Institute for Micro Integration (IFM), University of Stuttgart, Allmandring B, Stuttgart, Germany have published the paper: Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime Characterization, in the Journal: Micromachines 2022, 13, 1240. of /2022/
- what: In this paper soldering and conductive adhesive bonding of 0603 and 0402 components on flexible polyimide substrates is compared using the design of experiments methods (DoE) considering failure for shear strength and bending behavior.
SUMMARY
The assembly technologies continuous furnace soldering . . .
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