HIGHLIGHTS
- who: Trajin Baptiste and Vidal Paul-Etienne from the Laboratoire Génie de Production, LGP, Université de Toulouse, INP-ENIT, Tarbes, France have published the research: Bond graph multi-physics modeling of encapsulating materials in power electronic modules, in the Journal: (JOURNAL)
- how: This specific formalism could be applied in the study to visually describe thermo-mechanical links that are considered in this paper but is not necessary.
- future: These points will be developed in future works.
SUMMARY
Wide-bandgap semiconductor materials (SiC, GaN,..) are able to operate at . . .
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