HIGHLIGHTS
- who: (C et al. from the Centre have published the research work: (C), in the Journal: (JOURNAL) of June/26,/1982
- what: 1) Amplitude deviation during ultrasonic wire bonding can be correlated to the wire deformation.
SUMMARY
The desired system should detect any weak bond, without damaging good bonds, and should operate on any type of wire bonder, independent of wire or product properties. The most promising methods are based on the observation that the vibration amplitude behaviour of the bonding tool can sometimes be correlated successfully to the bond quality . . .
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