HIGHLIGHTS
- who: (C et al. from the IstYtuto di Fisica, Via Campi, A, Modena, Italy have published the research work: (C), in the Journal: (JOURNAL)
- what: The aim of this paper is to show, in the form of an investigation into the failure mechanisms and the possibility of avoidance of them, a) the kinetics of the compound formation and b) the mechanisms responsible for the. growth.
SUMMARY
Au-A1 thermocompression bonds are generally used for monolithic and hybrid integrated circuits as well as for discrete devices. It has been observed that in . . .
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