HIGHLIGHTS
- who: Joshua A. Depiver from the School of Mechanical Engineering and the Built Environment, College of Engineering and Technology, University of Derby, Markeaton Street, Derby , AW, England, UK have published the article: Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging, in the Journal: (JOURNAL)
- what: This work showed that the higher the random vibration load imposed on the BGA-PCB assembly, the shorter the fatigue life of the BGA. The investigation aims to provide new knowledge on the impact of vibration on the fatigue life of solder joints made from . . .
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