HIGHLIGHTS
- who: Yanfeng Du et al. from the School of Materials Science and Engineering, Dalian University of Technology, Dalian, China have published the Article: Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints, in the Journal: Electronics 2023, 12, x FOR PEER REVIEW of /2023/
- what: In element in the whole This study provides further insight into the application of In-containing solders in electronic packaging. Previous studies mainly focused on the properties of Sn-In solders, the interfacial reactions and EM behavior of Sn-In . . .
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