Design and implementation of a micromechanical silicon resonant accelerometer

HIGHLIGHTS

  • who: Libin Huang 1 et al. from the School of Instrument Science and Engineering, Southeast University, Nanjing, China have published the Article: Design and Implementation of a Micromechanical Silicon Resonant Accelerometer, in the Journal: Sensors 2013, 13, 15785-15804 of 26/08/2013
  • how: In this technique the anodic bonding process is used to form a tight silicon-oxygen bond to adhere the silicon wafer and the glass wafer together. The normalized transfer function of the low-pass loop filter is expressed as follows When Equation is substituted into Equation the following expression is obtained . . .

     

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