HIGHLIGHTS
- who: Hyeokgi Choi and collaborators from the Department of Welding and Joining Science Engineering, Chosun University, Gwangju, Republic of Korea have published the research: Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes, in the Journal: Materials 2021, 14, x FOR PEER REVIEW of /2021/
- what: A comparative study was conducted to investigate the diffusion barrier properties of interfacial IMCs formed at Pt particles modified Sn-58Bi solders reacted with ENIG and ENEPIG. The analysis in this study shows . . .
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