Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders

HIGHLIGHTS

• who: Augusto Daniel Rodrigues from the Silicon Austria Labs GmbH, Europastr12, Villach, Austria Chemnitz University of Technology, Reichenhainer Straße, Chemnitz, Germany have published the article: Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders, in the Journal: (JOURNAL) of 11/07/2022
• what: In this study by exploiting the unique properties of a paper coating material (i.e. polypropylene) as a non-conductive adhesive it was shown that direct flip-chip bonding of the bare dies and devices could be successfully performed on paper without using any . . .
  

   

  

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