HIGHLIGHTS
- who: Siti Faqihah Roduan et al. from the Faculty of Chemical and Technology, Kompleks Pusat Pengajian Jejawi, Universiti Malaysia Perlis (UniMAP), Arau, Malaysia, Asachi Technical University of Iasu0327i, BlvdMangeron, No51, have published the research: Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy, in the Journal: Materials 2023, 16, x FOR PEER REVIEW of 22/Dec/2022
- what: A dimple microtexture was successfully developed on a copper substrate to enhance the surface characteristics.
- how: The IMC thickness was averaged to determine the difference in the growth of IMC . . .
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