Effects of grinding parameters on the processing temperature, crack propagation and residual stress in silicon nitride ceramics

HIGHLIGHTS

• who: Haipeng Yan and colleagues from the School of Mechanical Engineering, Hebei University of Science and Technology, Shijiazhuang, China have published the research work: Effects of Grinding Parameters on the Processing Temperature, Crack Propagation and Residual Stress in Silicon Nitride Ceramics, in the Journal: Micromachines 2023, 14, 666. of /2023/
• what: In this paper, the residual stress and crack growth in the grinding of silicon nitride ceramics were studied. The measured values in the experiments are relative values obtained on the basis of the original residual stress.
• how: The results showed that it . . .
  

   

  

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