HIGHLIGHTS
- who: Liang Xu et al. from the College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou, China have published the Article: Effects of pH Values and H2O2 Concentrations on the Chemical Enhanced Shear Dilatancy Polishing of Tungsten, in the Journal: Micromachines 2022, 762 of /2022/
- what: In this study, Chemical enhanced Shear Dilatancy Polishing (C-SDP) as a novel ultraprecision polishing method was proposed to obtain high surface quality tungsten.
- how: The results showed that both pH and H2 had significant effects tungsten C-SDP. Showed that under low-medium speed/pressure the . . .
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