HIGHLIGHTS
- who: Xingwang Hu and colleagues from the The Institute of Technological Sciences of Wuhan University, Wuhan University, Wuhan, China have published the article: Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis, in the Journal: Micromachines 2023, x of /2023/
- what: This study provides a valuable reference for the influence of voids on the thermal fatigue reliability of BGA solder balls. The results of this study show that the solder balls on the inner ring ratio exceeded 10.5% and 19.6 . . .
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