Electrically conductive adhesive based on thermoplastic hot melt copolyamide and multi-walled carbon nanotubes

HIGHLIGHTS

• who: Paulina Latko-Durau0142ek and collaborators from the Faculty of Materials Science and Engineering, Warsaw University of Technology, Wou0142oska , Street, Warsaw, Poland have published the Article: Electrically Conductive Adhesive Based on Thermoplastic Hot Melt Copolyamide and Multi-Walled Carbon Nanotubes, in the Journal: Polymers 2022, 14, x FOR PEER REVIEW of /2022/
• what: To overcome these weaknesses, the new approach focuses on applying carbon-based fillers or nanofillers.
• how: The obtained results are shown in Table 2 while the curves are shown in Figure TGA. obtained results are shown in Table 2 while . . .
  

   

  

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