HIGHLIGHTS
- who: Muhammad Salman Al Farisi and collaborators from the Department of Robotics, Graduate School of Engineering, Tohoku University, Sendai, Japan have published the Article: Electroplated Al Press Marking for Wafer-Level Bonding, in the Journal: Micromachines 2022, 13, 1221. of /2022/
- what: In this study a wafer bonding technique for heterogeneous integration using bonding frame is demonstrated. In this study, the electroplated Al is implemented as a part of the semiconductor microfabrication process.
SUMMARY
One approach is by performing the bonding process consecutively in the same chamber without breaking the vacuum . . .
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