Engineering copper adhesion on poly-epoxy surfaces allows one-pot metallization of polymer composite telecommunication waveguides

HIGHLIGHTS

  • who: Fouzi Addou and colleagues from the (UNIVERSITY) have published the research: Engineering Copper Adhesion on Poly-Epoxy Surfaces Allows One-Pot Metallization of Polymer Composite Telecommunication Waveguides, in the Journal: Coatings 2021, 11, 50. of 29/Dec/2020
  • what: In the present contribution the authors propose two innovative and scalable processes for the metallization of the internal faces of carbon fiber reinforced polymer radiofrequency waveguides foreseen for implementation in telecommunications satellites. This paper reports on a DLI-MOCVD process and two specific recipes that can form Cu films on the inner surfaces of composite . . .

     

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