Evaluation of solder joint reliability in 3d packaging memory devices under thermal shock

HIGHLIGHTS

• who: Shuai Zhou and colleagues from the School of Microelectronics, Tianjin University, Tianjin, China have published the research: Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock, in the Journal: Electronics 2022, 11, x FOR PEER REVIEW of /2022/
• what: In this paper the reliability of solder joints under thermal shock are evaluated for 3D packaging memory devices by means of the SEM and finite element analysis.
• how: To test aa crossIn order to study study the the microstructure microstructure changes changes during during the the thermal thermal shock . . .
  

   

  

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