HIGHLIGHTS
- who: Lorenzo Fabbri et al. from the Department of Chemistry "Ugo Schiff", University of Florence, Via della Lastruccia, Firenze (FI), Italy have published the paper: Exploiting the Combination of Displacement and Chemical Plating for a Tailored Electroless Deposition of Palladium Films on Copper, in the Journal: (JOURNAL) of 10/09/2021
- what: The aim of this work is the development of a cost-effective technique or combination of techniques able to produce high-quality Pd thin films with tailorable thickness on copper substrates. The authors attempted to combine two different palladium electroless processes to deposit . . .
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