Exploring topological semi-metals for interconnects

HIGHLIGHTS

• who: Satwik Kundu et al. from the School of Electrical Engineering and Computer Science, The Pennsylvania State University, Universty Park, PA, USA have published the paper: Exploring Topological Semi-Metals for Interconnects, in the Journal: (JOURNAL)
• what: The authors evaluate the unique properties of Weyl semi-metals (WSMs) for applications as global and local interconnect to address some of the aforementioned challenges. The authors provide a background on Weyl semi-metals below. The authors propose the deposition of CoPt on regular poly interconnect to develop a hybrid poly-WSM interconnect for local routing in standard . . .
  

   

  

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