Fabrication of ultra-fine micro-vias in non-photosensitive polyimide for high-density vertical interconnects

HIGHLIGHTS

• who: Yao Wang and colleagues from the Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou, China School of Engineering and Technology, China University of Geosciences, Beijing, China have published the paper: Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects, in the Journal: Micromachines 2022, 13, x FOR PEER REVIEW of /2022/
• what: __SECTION__ 4. Conclusions.

SUMMARY

In the plasma etching process of polyimide, etch gases and etch gas mixtures accounted for mostly pure O2 or process of polyimide, gases and etch gas mixtures accounted . . .

 



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