HIGHLIGHTS
- who: Durand Camille and collaborators from the Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany have published the paper: Fracture mechanics in new designed power module under thermo-mechanical loads, in the Journal: (JOURNAL)
- what: Simulations with different tests parameters were performed and it results in different stresses and fracture criterions.
SUMMARY
On this account, a new type of Assembly Interconnected Technology used to connect MOSFETs in power modules has been developed. The reliability is increased by using a copper clip soldered on the top side of the chip, avoiding the use . . .
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