HIGHLIGHTS
- who: Xian Wu and collaborators from the (UNIVERSITY) have published the article: Highly thermally conductive boron nitride, in the Journal: (JOURNAL)
SUMMARY
With the integration and continuous miniaturization of electronic devices, heat dissipation has become the main factor that affects the work stability and lifetime of Xian Wu et_al 2 Experimental Vinyl acetateethylene resin (VAE 707) was provided by Guangzhou Deep Gen Chemical (Guangdong Province, China). with random distributed BNs were prepared by melt mixing BN-coated UHMWPE particles in a torque rheometer at 220°C for 15 min. The obtained composites were . . .
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