Improving the thickness uniformity of micro gear by multi-step, self-aligned lithography and electroforming

HIGHLIGHTS

• who: Huan Wang and collaborators from the Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Beijing, China have published the paper: Improving the Thickness Uniformity of Micro Gear by Multi-Step, Self-Aligned Lithography and Electroforming, in the Journal: Micromachines 2023, 775 of /2023/
• what: In this paper a new fabrication method is proposed to improve the thickness uniformity of micro gear which is the key element of various microdevices.
• how: The results showed that the thickness distributions under different under different TPs. The . . .
  

   

  

  If you want to have access to all the content you need to log in!

  Thanks :)

  Username or Email

  Password

  Remember me

  Lost your password?

  If you don't have an account, you can create one here.