HIGHLIGHTS
- who: Chen Liu and collaborators from the State Key Laboratory of Mechanics and Control of Mechanical Structures, Nanjing University of Aeronautics and Astronautics, Nanjing, China have published the article: Improving Thermal Conductivity and Tribological Performance of Polyimide by Filling Cu, CNT, and Graphene, in the Journal: Micromachines 2023, 14, 616. of /2023/
- what: The effects of copper powder, carbon nanotube, and graphene on the thermal conductivity of PI are studied by molecular dynamics simulation.
- how: The results showed that with the increase in the content of hybrid filler the thermal conductivity of the . . .
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