Investigating a machine learning approach to predicting white pixel defects in wafers—a case study of wafer fabrication plant f

HIGHLIGHTS

  • What: The insights garnered from this study aim to arm operators with proactive measures to diminish the potential for customer complaints. This study examines how Company F (Taiwan, China), a leading semiconductor wafer manufacturer in Taiwan, tackles white pixel defects, focusing on enhancing response to customer complaints and defect analysis. By employing machine_learning techniques, the study aims to improve resource utilization and identify defect causes through reverse engineering. 7 of 26 Due to the company need to immediately resolve the white pixel defect problem, this study focuses solely on the impacted blade grinding process.
  • Who . . .

     

    Logo ScioWire Beta black

    If you want to have access to all the content you need to log in!

    Thanks :)

    If you don't have an account, you can create one here.

     

Scroll to Top

Add A Knowledge Base Question !

+ = Verify Human or Spambot ?