Investigation of the thermal conductivity enhancement mechanism of polymer composites with carbon-based fillers by scanning thermal microscopy

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  • who: Wenxiang Sun et al. from the Centre d`Energu00e9tique et de Thermique de Lyon (CETHIL), UMR CNRS, INSA Lyon, UCBL, Universitu00e9 de Lyon, Villeurbanne, France Engineering Faculty, Mechanical Engineering Department, Dokuz Eylul University, Tinaztepe Campus, Buca have published the paper: Investigation of the thermal conductivity enhancement mechanism of polymer composites with carbon-based fillers by scanning thermal microscopy, in the Journal: (JOURNAL)
  • what: To elucidate the mechanism of enhancement of heat transfer in polymer composites in this work the authors investigated two types of polymer-carbon filler composites. It was recognized from this study . . .

     

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