HIGHLIGHTS
- who: Stijn Wielandt and collaborators from the (UNIVERSITY) have published the research work: Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature, in the Journal: Sensors 2022, 22, 2814. of /2022/
- what: The authors characterize the system's electromechanical properties and investigate the accuracy of deformation measurements. This research shows the suitability of low-cost accelerometer arrays for distributed soil stability monitoring. In comparison with emerging low-cost measurements of surface displacement the approach provides depth-resolved deformation which can inform about shallow sliding surfaces. The authors . . .
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