Mathematical model for skin pain sensation under local distributed mechanical compression for electronic skin applications

HIGHLIGHTS

• who: Dongcan Ji and collaborators from the Institute of Solid Mechanics, Beihang University (BUAA), Beijing, China have published the paper: Mathematical Model for Skin Pain Sensation under Local Distributed Mechanical Compression for Electronic Skin Applications, in the Journal: Micromachines 2022, 13, x FOR PEER REVIEW analysis. of /2022/
• what: In this paper a model for skin pain sensation under compression is established in which the Flament solution the revised Hodgkin-Huxley model and the model gate control theory are considered simultaneously.
• how: In the following parts of tribution is obtained based the solution . . .
  

   

  

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