HIGHLIGHTS
- who: Zihao Dong from the similar strategies, polyimide can be prepared from poly(amic acid) (PAA) and then thermally cured to thin filmsApplications of polyimide coatings include the encapsulation of implantable devices, dielectric layers for D packaging, integrated capacitors and the photopatterning of microstructures. As early as the, s, polyimide encapsulation has been used in a silicon-based neural electrode array from the University of Utah have published the Article: Microfabrication of functional polyimide films and microstructures for flexible MEMS applications, in the Journal: (JOURNAL)
- what: The aims of this review are to systematically discuss . . .
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