Microwave-assisted solvent bonding for polymethyl methacrylate microfluidic device

HIGHLIGHTS

• who: Chia-Wen Tsao and colleagues from the Department of Mechanical Engineering, National Central University, Taoyuan City, Taiwan have published the Article: Microwave-Assisted Solvent Bonding for Polymethyl Methacrylate Microfluidic Device, in the Journal: Micromachines 2022, 1131 of /2022/
• what: The authors propose using microwave for directly heating the organic solvent at the bonding interface for microfluidic device bonding. The authors demonstrate a microwave-assisted solvent bonding that directly seals the PMMA substrates. Since the authors aimSince to the authors aim to a have a simple and straightforward bonding process, the solvent a have a . . .
  

   

  

  If you want to have access to all the content you need to log in!

  Thanks :)

  Username or Email

  Password

  Remember me

  Lost your password?

  If you don't have an account, you can create one here.