Numerical simulation of mold filling of polymeric materials with friction effect during hot embossing process at micro scale

HIGHLIGHTS

• What: A constitutive model considering the work hardening and strain softening was applied to describe the thermomechanical behavior of PMMA. Andconcerned Perspectives This research the investigation of the viscoplastic behaviors of PC and This research concerned the investigation of the viscoplastic behaviors of PC and This research concerned the investigation the viscoplastic behaviors of PC and PMMA polymers and their influence on the fillingof efficiency of micro HE.
• Who: Faleh Rabhi and colleagues from the Institut FEMTO-ST, National Centre for Scientific Research (CNRS), University of Franche-Comté, Besançon, France have published the Article . . .
  

   

  

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