HIGHLIGHTS
- who: Shunta, Haradaa and Kenta, Murayamab from the Institute of Materials and Systems for Sustainability, Nagoya University, Furo-cho, Nagoya, Japan, and bMipox have published the research work: Observation of in-plane shear stress fields in off-axis SiC wafers by birefringence imaging, in the Journal: (JOURNAL)
- what: The authors show the distribution of in-plane shear stress with a color scale in which the positive values are dark and the negative values are bright for comparison with birefringence image contrast.
SUMMARY
55, 1029-1032 Silicon carbide (SiC) is a promising . . .
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