HIGHLIGHTS
- who: Milad Ghayoor and Ali M. Hadian from the Department of Mechanical, Industrial and Manufacturing Engineering, Oregon State University, Corvallis, OR, USA have published the paper: On the Role of Bonding Time on Microstructure and Mechanical Properties of TLP Bonded Al/Mg2Si Composite, in the Journal: (JOURNAL)
- what: In this study, the TLP bonding process using copper powder was adopted to join the Al/Mg2 Si composite and the role of holding time on microstructure evolution and mechanical properties were investigated. The interface line was not straight across the bonding line probably due to the . . .
If you want to have access to all the content you need to log in!
Thanks :)
If you don't have an account, you can create one here.