Organic materials a low-temperature curable conformal adhesive layer for monolithic lamination of thin film encapsulation

HIGHLIGHTS

  • who: Short Communication and colleagues from the Department of Chemical and Biomolecular Engineering, Daejeon, Republic of Korea have published the Article: Organic Materials A Low-Temperature Curable Conformal Adhesive Layer for Monolithic Lamination of Thin Film Encapsulation, in the Journal: (JOURNAL)
  • what: A low-temperature curable thin adhesive layer capable of forming a conformal adhesion interface to various substrates was newly developed.
  • how: In this study a low-temperature curable adhesive thin film with low glass transition temperature (Tg) is newly designed and synthesized. To avoid this problem an optically clear adhesive (OCA . . .

     

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